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Date: | Wed, 08 May 96 11:49:01 EST |
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Some designers make an effort to maintain a web of soldermask between
the solder pads on SMT devices, where pad spacing permits. When the
spacing of fine pitch devices preclude the web, it is omitted. I have
heard that the webs are used to reduce solder bridging.
Thinking through this issue, I find webs being used where pad spacing
is large enough so as to make solder bridging unlikely, while webs are
omitted when the pad spacing is close enough to make solder bridging
most likely.
I am interested in any factual data that supports the reason for, or
the value of, soldermask webs.
Thank you in advance for your response.
Jim williams
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