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Tue, 7 May 1996 08:51:03 +0200 |
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| From [log in to unmask] Wed May 15 16: |
26:59 1996 |
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id m0uGgMp-00008ZC; Tue, 7 May 96 01:35 CDT |
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Hello
I face a problem with the design of foodprints for wave soldering of SMT
components with partially non wetting surfaces. By using the elasticas as
statet by R.J. Klein Wassink ( Soldering in electronics ) I get endles
pads. I belive I have a serious problem of understanding. R.J. has retired.
Does someone know how I can reach him or is there a Guru that can help me ?
Maybe one of the Philips folks who wrote the Guidelines for Footprint
Design?
Best regards
Guenter
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