Received: |
by ipc.org (Smail3.1.28.1 #2)
id m0uGXbc-00008xC; Mon, 6 May 96 16:14 CDT |
Encoding: |
25 Text |
Old-Return-Path: |
|
Date: |
Mon, 06 May 96 14:08:58 CST |
Precedence: |
list |
Resent-From: |
|
Resent-Sender: |
|
X-Status: |
|
Status: |
O |
X-Mailing-List: |
|
TO: |
|
Return-Path: |
<TechNet-request> |
Resent-Message-ID: |
<"uRIpJ2.0.3i9.VkcZn"@ipc> |
Subject: |
|
From: |
|
From [log in to unmask] Wed May 15 15: |
08:37 1996 |
X-Loop: |
|
Message-Id: |
|
Parts/Attachments: |
|
|
What is the preferred surface finish for PWB's with PBGA packages?
I have been looking at some published industry data regarding PWA
assemblies with plastic BGA's and so far all have had HASL surface
finish and very little data on OSP (organic Solderability
Preservatives such as Entek) coated boards.
Has anyone had any OSP coated (Entek 106) mother board designs with
BGA packages in production?
What are the pro and con's with HASL Vs. ENTEK for BGA assembly?
Using Entek boards, what kind of flux is better to use, NO CLEAN or
water soluble?
The preferred surface finish for assembling fine pitch components has
become Entek (or Entek equivalent) for better coplanarity criteria,
but is there a danger using Entek boards for BGA assembly?
I would greatly appreciate any information you can share with me.
[log in to unmask]
(800) 289-3355 EXT 85408
or
512-728-5408 direct line
Thanks, Gita
|
|
|