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| From [log in to unmask] Thu May 2 12: |
35:27 1996 |
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I am trying to "optimize" a screen printing operation. This
operation screens solder-paste for both SMD and
Through-Hole(Paste-In-Hole). I am using a solder-paste that is
90% solids(Non-No-Clean) with a viscosity of 1M(cps)+-100K(cps).
Whew!...Finally my question(s):
I have found that a higher viscosity helps when doing fine-pitch
but I may be hurting myself when doing Paste-In-Hole. Is there a
relationship (weak or strong) between solids-content and
viscosity or do I keep the solids-content a constant and simply
ask for a lower viscosity solder-paste if I need it for (PIH)?
Thanks
Harlan
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