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1996

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Thad,  guide line to specify conductor to PCB edge spacing are:

                                            minimum
                                       standard
Internal layer            0.020 inches + process variation       0.050
inches+ process var.
External Layer                                   0.100 inches + process
variation

The purpose being not to expose the conductor to the environment that may
cause corrosion or migration.

Pratap Singh
RAMP Labs 




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