 
| Mime-Version: |
1.0 |
| Content-Type: |
text/plain; charset="us-ascii" |
| Old-Return-Path: |
|
| Date: |
Fri, 26 Apr 1996 11:30:27 -0700 |
| Precedence: |
list |
| Resent-From: |
|
| Resent-Sender: |
|
| X-Status: |
|
| Status: |
O |
| X-Mailing-List: |
|
| X-Sender: |
|
| TO: |
|
| Return-Path: |
<TechNet-request> |
| X-Loop: |
|
| Resent-Message-ID: |
<"kzskR3.0.ZuL.r9IWn"@ipc> |
| Subject: |
|
| From: |
|
| From [log in to unmask] Wed May 1 12: |
58:35 1996 |
| Received: |
by ipc.org (Smail3.1.28.1 #2)
id m0uCt66-00008xC; Fri, 26 Apr 96 14:22 CDT |
| X-Mailer: |
Windows Eudora Version 1.4.4 |
| Message-Id: |
|
| Parts/Attachments: |
|
|
We are discussing excess solder on a SOT-23 for a critical DOD application
per MIL-STD-2000A. The condition is solder contacting the body of the
component between the PWB and the body, also solder contacts the lead seal.
Per 2000A this "shall not" be done but it is not in Table 1 as requiring
disposition. My real question is, what is the risk for this condition and
does anyone have any supporting data (good, bad or otherwise)?
Thank you in advance for all responses.
[log in to unmask]
|
|
|
