Received: |
by ipc.org (Smail3.1.28.1 #2)
id m0uCp86-00007qC; Fri, 26 Apr 96 10:08 CDT |
Old-Return-Path: |
|
Date: |
Fri, 26 Apr 1996 11:06:17 -0400 (EDT) |
Precedence: |
list |
Resent-From: |
|
Resent-Sender: |
|
X-Status: |
|
Status: |
O |
X-Mailing-List: |
|
TO: |
|
Return-Path: |
<TechNet-request> |
Resent-Message-ID: |
<"GjJ4x2.0.wdJ.XREWn"@ipc> |
Subject: |
|
From: |
|
From [log in to unmask] Wed May 1 12: |
54:49 1996 |
X-Loop: |
|
Message-Id: |
|
Parts/Attachments: |
|
|
Please give me your opinion on repeated HASL steps during fabrication as a rework step for exposed CU. We do spec ucl and lcl.
Is rework common?
Rework w/o stripping off original solder.
Impact on reliability?
Etc.
Thanks people...
|
|
|