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From [log in to unmask] Wed May 1 09: |
29:21 1996 |
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<"c-u9T.0.imA.myuVn"@ipc> |
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Try tin immerse or even a thin coating of oxide on one panel.
If you suspect surface contaminates, this is a simple easy test
that can be stripped off. If your problem is tape residue, good luck.
That's a hard one to get rid of. (Until you remove the tape variable)
Groovy
______________________________ Reply Separator _________________________________
Subject: Exposed copper after electroless nickel gold
Author: [log in to unmask] at SMTPLINK-HADCO
Date: 4/25/96 9:22 AM
Recently we encounter exposed copper problem after electroless nickel gold
process ,
we wish to know if there any way to determine the stubborn film on top of
the copper
that prevent the plating to take place . We understand that soldermask on pad or
poor rinsing after final development could give rise to such problem . Such
problem
of soldermask on pad could be easily found after HAL but cases of minor
soldermask
on pad could not be detected in HAL . Please advise .
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