I am aware of the importance of a well controlled copper 
     oxidization process to promote good inner layer adhesion for 
     multi-layer PCB's. It has been brought to my attention that a weak 
     copper oxide layer (maybe the crystal structure is too long) may cause 
     electrical problems on the inner layers as the structure crumbles in 
     the lamination stages, possibly creating a time-bomb scenario with 
     shorts forming later when electrically stressed.
     
     
        Has anybody out there experienced this phenomenon or do you know of 
     any articles or papers on the subject.
     
                Regards  Gary Willard
                         Motorola (UK)
                         E-mail [log in to unmask]