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| From [log in to unmask] Sat Apr 27 16: |
59:03 1996 |
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The proliferation of sub .5mm peripheral leaded SMD's is causing
assembly people to look at the overall size relationship
between the master data and the actual board. When solder paste
is stenciled on larger boards (say, 12-16"), the stencil image
many times will not match the land pattern, causing shorts in the
fine pitch area.
My question:
How much growth (or shrink) should one expect land-to-land over
a 16" distance? This has nothing to do with drilling; just master
pattern to actual board size...
Thanks,
marko
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