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12:13 1996 |
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HI ! I am writing a chapter for a book 'Failure modes and Mecahnisms in
Electronics Packaging'. This chapter deals with what suppliers and their
customers find on the product returned from the field due to malfunction or a
suspected failure. The data is being organised as follows:
Failure Mode Mother Board Adapter Cards
Memory Cards
------------------------------------- ----------------------
------------------------ ------------------------
1. No defect Found % or ppm % ppm
% or ppm
(Retest OK)
2. PCB related
- Shorts
- Opens
- Corrosion
- migration
3. Solder Joints (SM)
(opens)
4. Solder Joints (PIH)
(opens)
5. Components(Active)
- ESD
- Wire Bonds
- Corrosion
- Migration
- Electrical Overstress
- Thermal Stress
6. Components (Passive)
- Solder Joints(opens)
- Electrical Short
- Electrical Open
7. Connectors
- No Defect Found
- Intermittent
- Corrosion
- Metallurgy
- Mechanical
The data can be as % or ppm. A generic pareto data format is useful for this
type of discussion and no source will be identified with a particular data
set. Each source will be greatfully acknowledged by the authors. Thank You
for your help.
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