 
| Mime-Version: |
1.0 |
| Content-Type: |
text/plain; charset="us-ascii" |
| Old-Return-Path: |
|
| Date: |
Tue, 16 Apr 1996 13:04:07 -0500 |
| Precedence: |
list |
| Resent-From: |
|
| From [log in to unmask] Wed Apr 24 09: |
47:33 1996 |
| Resent-Sender: |
|
| X-Status: |
|
| Status: |
O |
| X-Mailing-List: |
|
| X-Sender: |
|
| TO: |
|
| Return-Path: |
<TechNet-request> |
| Resent-Message-ID: |
<"V_LGT2.0.3oB.y_zSn"@ipc> |
| Subject: |
|
| From: |
|
| X-Loop: |
|
| Received: |
by ipc.org (Smail3.1.28.1 #2)
id m0u9F2D-00007yC; Tue, 16 Apr 96 12:59 CDT |
| X-Mailer: |
Windows Eudora Pro Version 2.1.2 |
| Message-Id: |
|
| Parts/Attachments: |
|
|
We have just started using a dry film mask(Vacrel), which is about .003"
thick. We are using a .006" stencil and printing .020" pitch parts, and are
measuring paste thickness of about .009". We are using a metal squeegee,
but seeing some "dog ear" looks to the paste. We seem to be getting a poor
separation of paste from the stencil. The mask is about .0005" higher than
the pads. Our variation in paste height measurements on a board has
increased by .002" from Photo Imageable to dry film.
Are there any ideas on how to process a board with Vacrel to improve our
printing process?
Thanks for any ideas/suggestions.
Steve Quinn
Heurikon Corp
8310 Excelsior Dr
Madison, Wi 53717
[log in to unmask]
|
|
|
