TECHNET Archives

1996

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Received:
by ipc.org (Smail3.1.28.1 #2) id m0u9ADw-000079C; Tue, 16 Apr 96 07:51 CDT
Old-Return-Path:
Date:
16 Apr 1996 08:32:46 -0400
Precedence:
list
Resent-From:
Message-ID:
X-Status:
Status:
O
X-Mailing-List:
<[log in to unmask]> archive/latest/3458
TO:
"IPCTechNet" <[log in to unmask]>, "Lyle Andersen" <[log in to unmask]>
From [log in to unmask] Mon Apr 22 16:
43:43 1996
Return-Path:
<TechNet-request>
Resent-Message-ID:
<"ElScL2.0.0CD._UvSn"@ipc>
Subject:
From:
"LISA GREENLEAF" <[log in to unmask]>
Resent-Sender:
TechNet-request [log in to unmask]
X-Mailer:
Mail*Link SMTP-QM 3.0.2
X-Loop:
Parts/Attachments:
text/plain (25 lines)
PRF 31032, which is the spec intended to replace MIL P 55110 has the same
requirements in it for etchback, which are .0002 - .003" when specified by the
master drawing.  If no etchback is specified, than a negative etchback of
.0005 is allowable.

--------------------------------------
Date: 4/15/96 10:23 AM
To: LISA GREENLEAF
From: Lyle Andersen
Can anyone inform me of the current status of the military requirement re: 
etchback?  A potential customer's blueprint references 55110D and 
specifically calls out for etchback on type 3 boards (multilayer). However, 
the board will have a commercial application and,  as is common with 
blueprint notes, this may be of the "boilerplate" variety.  They may be 
satisfied with desmear with a little education and persuasion.  Thanks to 
any who respond.

Lyle Anderson
Electrostar-Utah Division (formerly Lundahl Astro Circuits
Phone 801-753-4700 ext. 3040





ATOM RSS1 RSS2