 
| Received: |
by ipc.org (Smail3.1.28.1 #2)
id m0u7iMk-00007JC; Fri, 12 Apr 96 07:54 CDT |
| Encoding: |
22 Text |
| Old-Return-Path: |
|
| Date: |
Fri, 12 Apr 96 07:57:01 cst |
| Precedence: |
list |
| Resent-From: |
|
| Cc: |
|
| From [log in to unmask] Fri Apr 12 08: |
56:23 1996 |
| Status: |
O |
| X-Mailing-List: |
|
| TO: |
|
| Return-Path: |
<TechNet-request> |
| Resent-Message-ID: |
<"p0CKg1.0.YxJ.v9bRn"@ipc> |
| Subject: |
|
| From: |
|
| X-Status: |
|
| X-Loop: |
|
| Resent-Sender: |
|
| Message-Id: |
|
| Parts/Attachments: |
|
|
Hi Karl - please define what you mean by "open". Is it the solder
joint or is it the component?
Dave Hillman
Rockwell Collins
[log in to unmask]
______________________________ Reply Separator _________________________________
Subject: Open Diodes
Author: [log in to unmask] at ccmgw1
Date: 4/11/96 7:41 PM
We are having a problem with melf diode components being open after reflow
solder. Would using the IPC detent pattern reduce this problem?
Karl Kaylor
[log in to unmask]
(317) 587-4684
|
|
|
