Received: |
by ipc.org (Smail3.1.28.1 #2)
id m0u7Sgx-0000AYC; Thu, 11 Apr 96 15:10 CDT |
Encoding: |
7 TEXT |
Old-Return-Path: |
|
Date: |
Thu, 11 Apr 96 15:17:00 PDT |
Precedence: |
list |
Resent-From: |
|
Message-ID: |
|
X-Status: |
|
Status: |
O |
From [log in to unmask] Thu Apr 11 16: |
12:34 1996 |
TO: |
|
Return-Path: |
<TechNet-request> |
Resent-Message-ID: |
<"UrlBk2.0.nWF.USMRn"@ipc> |
Subject: |
|
From: |
|
X-Loop: |
|
X-Mailing-List: |
|
X-Mailer: |
Microsoft Mail V3.0 |
Resent-Sender: |
|
Parts/Attachments: |
|
|
We are having a problem with melf diode components being open after reflow
solder. Would using the IPC detent pattern reduce this problem?
Karl Kaylor
[log in to unmask]
(317) 587-4684
|
|
|