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I guess the posting from Norm is going to lead to a lot of interest.
We would like to know how to tent vias in a curtain coat environment!
We use a number of techniques which are costly. e.g. screen printing the
LPI 1st then processing wet through curtain coat or even printing with a
stencil defined mask on the vias only with LPI. These procedures seem
to work but they are very time consuming. Obviously hole diameter is a
consideration. We use these methods on 12 to 20 mil holes.
Any other ideas?
Richard Wood-Roe
Artetch Circuits Ltd.
Littlehampton, UK
Email [log in to unmask]
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