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| From [log in to unmask] Wed Apr 3 17: |
48:28 1996 |
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<simon.ipc.org!nicmad.nicolet.com!nicmad.nicolet.com!mcguine> |
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Wed, 03 Apr 1996 08:30:49 -0600 |
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Can you be more specific. What types of components are on the board?
At 11:37 4/3/96 +0800, Chan Yong Kwee wrote:
>Good day,
> We have encountered a low solder paste level in the printing
>process. We are using a Metal squeegee on a Metal Screen to print the
>solder paste onto the PCB before SMT processes.
> We were wondering whether the solder paste viscosity is too thick;
>or there is a Stencil Design fault. The SPC chart states the solder paste
>thickness should be between 6.5 mil to 8.5 mil. But we can only achieve
>only up to 6.2 mil of solder paste thickness. Our stencil is 6.0 mil in
>thickness.
> Can anyone give me the specifications on the design of Metal
>Stencils and give suggestions on how to solve the above problems? Thank you.
>
>Regards,
>Chan Yong Kwee
>E-mail:[log in to unmask]
>Tel : (65) 746-6617
>Pg : 9-490-6514
>
>
>
-Pat-
-------------
Patrick McGuine
Nicolet Instrument
[log in to unmask]
(608) 276-6334
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