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47:40 1996 |
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Typically when LPI is used to tent vias, one side of the board will seal
and the other may have pin holes or openings in the mask that covers the
via. This creates a copper lined cup capable of trapping any subsequent
chemistry liquids that it may be exposed to (fluxes, cleaners, etc.).
Is this concern reduced when nickel/gold are plated over the entire
copper board?
Please share your via tenting experiences. Thanks.
Norm Dill
RF Communications
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