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| From [log in to unmask] Wed Apr 3 16: |
36:16 1996 |
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We are using a RMA-Flux(Alpha 615-25) followed by a cleaning
process that utilizes Axarel-36.
Thanks for your reply - Harlan
______________________________ Reply Separator _________________________________
Subject: FW: Nickel/Gold Immersion
Author: [log in to unmask] at INTERNET
Date: 3/29/96 3:03 PM
Harlan,
What type of flux and cleaning process are you using?
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From: TechNet-request
To: TechNet
Subject: Nickel/Gold Immersion
Date: Friday, March 29, 1996 8:10AM
We have experienced dramatic yield improvements in SMT by
utilizing Nickel/Gold (2-6 micro-inches of Gold over 100
micro-inches of Nickel) instead of Tin/Lead(HASL) on our Printed
Wiring Boards. Due to Mixed Technology Designs, several of these
Designs are processed through Wave-Solder. We have experienced
the obvious, increased Gold contamination in the pot, but yields
have also increased. We have stepped-up Pot samples and Pot
changes to overcome this problem.
Is anyone else processing Nickel/Gold plated Printed Wiring
Boards across Wave-Solder and have there been any problems other
then what I have listed above?
Thanks for your time - Harlan
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