TECHNET Archives

1996

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Mime-Version:
1.0
Content-Type:
text/plain; charset="us-ascii"
Old-Return-Path:
Date:
Fri, 29 Mar 96 11:29 EST
Precedence:
list
Resent-From:
Resent-Sender:
TechNet-request [log in to unmask]
X-Status:
Status:
O
X-Mailing-List:
<[log in to unmask]> archive/latest/3198
X-Sender:
TO:
"Bruenning, Jason" <[log in to unmask]>
Return-Path:
<TechNet-request>
X-Loop:
Received:
by ipc.org (Smail3.1.28.1 #2) id m0u2gyz-00007iC; Fri, 29 Mar 96 10:25 CST
Resent-Message-ID:
<"DgsUZ2.0.VO7.Rx0Nn"@ipc>
From [log in to unmask] Wed Apr 3 16:
28:15 1996
From:
[log in to unmask] (Jerry Schwartz)
Cc:
Subject:
X-Mailer:
Windows Eudora Version 1.4.4
Message-Id:
Parts/Attachments:
text/plain (27 lines)
>
>Greetings,
>
>Does anyone have a good procedure for removing a warp/twist from a pcb?  I 
>am dealing with a .093 thick assembly that is 7 inches by 20 inches.  The 
>board currenly has smt components placed and soldered (topside only) but, 
>the through hole components have not yet been mounted/soldered.  I have 
>tried heating the board and letting it cool while applying weight, that did 
>not do the job.  Any suggestions ? please respond.
>
>Thanks,
>
>[log in to unmask]
>
>
>
If it came to you like that from your supplier SEND IT BACK!
Also a pre bake of the bare board to reduce moisture should help
warp later in the process.

Regards,
Jerry Schwartz
[log in to unmask]
"May The Schwartz Be with You"



ATOM RSS1 RSS2