 
| Received: |
by ipc.org (Smail3.1.28.1 #2)
id m0u2IND-00006eC; Thu, 28 Mar 96 08:08 CST |
| Encoding: |
7 Text |
| Old-Return-Path: |
|
| Date: |
Thu, 28 Mar 96 08:11:54 cst |
| Precedence: |
list |
| Resent-From: |
|
| Resent-Sender: |
|
| X-Status: |
|
| Status: |
O |
| X-Mailing-List: |
|
| TO: |
|
| Return-Path: |
<TechNet-request> |
| Resent-Message-ID: |
<"so1ak.0.gOC.MrfMn"@ipc> |
| Subject: |
|
| From: |
|
| From [log in to unmask] Thu Mar 28 11: |
37:13 1996 |
| X-Loop: |
|
| Message-Id: |
|
| Parts/Attachments: |
|
|
Good morning:
I guess I've never heard that particular jargon for it, but we
used to see it, particularly on Duroid-type materials, with the
impingement of the jets in a jet pumice scrubber and later with the
aluminum oxide jet scrubber. It's a good argument for having a chem
clean optional cleaning process, if you can stand the redundancy.
Marc Carter
|
|
|
