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| From [log in to unmask] Thu Mar 28 11: |
35:38 1996 |
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Two Questions:
1. Has anyone any suggestable downsides or advantages to a manufacturing
procedure called EBP (etch before plating) technology.
2. Also Has anyone used PCBs with a base material CEM33. How does it differ
from other types of material (CEM-1, FR4 etc.) in relation to temperature
tolerances/variations, pad adhesion etc.?
Thanks,
Martin Dooner
AMT Ireland
University of Limerick
Ireland
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