 
| Received: |
by ipc.org (Smail3.1.28.1 #2)
id m0u1vgs-00006dC; Wed, 27 Mar 96 07:55 CST |
| From [log in to unmask] Thu Mar 28 09: |
50:00 1996 |
| Old-Return-Path: |
|
| Date: |
27 Mar 1996 09:02:00 U |
| Precedence: |
list |
| X-Loop: |
|
| Resent-Sender: |
|
| X-Status: |
|
| Status: |
O |
| X-Mailing-List: |
|
| TO: |
|
| Return-Path: |
<TechNet-request> |
| Resent-Message-ID: |
<"iG3LQ.0.ciD.zYKMn"@ipc> |
| Subject: |
|
| From: |
|
| Resent-From: |
|
| Message-Id: |
|
| Parts/Attachments: |
|
|
Does anybody have information and or studies done on bonding glass bodied chip
with chip bonding material such a loctite 3609 for wave soldering. Also looking
for out-gasing data on any material that could be used for space applications.
Hector Valladares
Honeywell Space systems
Principle SMT Engineer
813-539-3683 voice
[log in to unmask]
|
|
|
