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From [log in to unmask] Thu Mar 21 13: |
27:15 1996 |
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Mike, we ran into a similar problem here a few years ago. Our solution
was to assemble complete, spray RMA flux on both sides, place in an
inert atmosphere over @ 240 deg F for 4 hrs, let cool then process
through the normal flow soldering process.
Gary Santavicca
Nothrop Grumman Corp
Manufacturing Services
______________________________ Reply Separator _________________________________
Subject: Re: ASSY
Author: [log in to unmask] at Internet
Date: 3/21/96 10:36 AM
Mike, I would ditto Jerry Cupples remarks. However, I have some additional
concerns about possible blistering caused by moisture absorption over the
years. Baking would help that, but baking can also increase any oxidation
problems.
You definitely have a challenge on your hands.
Good luck
Charlie Barker
Input/Output, Inc.
713/276-3328
To: TechNet @ ipc.org @ Internet
cc: (bcc: Charles Barker/IO-US)
From: mcussen @ medar.com (Mike Cussen) @ Internet
Date: 03/15/96 07:38:03 AM
Subject: ASSY
I have a six layer board (FR4) that has been setting on the shelf for three
years, and not stored in plastic bags.
What would be your recommendation to assure that these boards would solder
properly, when processed?
Thanks In Advance
Michael Cussen
Medar Inc.
mcussen@medar
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