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Peter,
To answer you questions directly::
Q: what material do I use as the barrier.
A; Try CDM
Q: what minimum material thickness do I need to prevent material
warpage over repeated heat cycles.
A: about 8mm ot thicker.
Q: what minimum opening size is acceptable to allow solder to flow
up to the circuit board.
A: depends on components sizes and surounding components
Q: would using the chip wave help?
A: Always
KHFC-HK
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