TECHNET Archives

1996

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Received:
by ipc.org (Smail3.1.28.1 #2) id m0tzTlL-00007DC; Wed, 20 Mar 96 13:41 CST
Old-Return-Path:
From [log in to unmask] Wed Mar 20 16:
03:45 1996
MIME-version:
1.0
Precedence:
list
Resent-From:
Resent-Sender:
TechNet-request [log in to unmask]
X-Status:
Status:
O
X-Mailing-List:
<[log in to unmask]> archive/latest/3075
TO:
Content-transfer-encoding:
7BIT
X-Loop:
Content-type:
TEXT/PLAIN
Subject:
Message-id:
Return-Path:
<TechNet-request>
Resent-Message-ID:
<"4WOKR3.0.SoC.oz5Kn"@ipc>
From:
Date:
Wed, 20 Mar 1996 14:42 -0500 (EST)
Parts/Attachments:
TEXT/PLAIN (22 lines)
     
        We are presently considering the use of carbon-impregnated  
     cardboard (for ESD) for the storage of small assemblies with Silver 
     and Gold Leads.  
        It is well understood in industry that Sulfur impairs the 
     solderability of the surface but does anyone know if sulfur has any 
     other detrimental affects on Silver and Gold finishes (i.e. corrosion, 
     etc.).  These pins will not be soldered therefore solderability of the 
     surface is not a concern.  We just want to confirm there is no other 
     detrimental affects of Sulfur.
     
        Thanks for your time.
     
     Kevin Frasier
     Scientific-Atlanta
     [log in to unmask]
     http://www.Sciatl.com
     
      



ATOM RSS1 RSS2