 
| Received: |
by ipc.org (Smail3.1.28.1 #2)
id m0txcog-00006VC; Fri, 15 Mar 96 10:57 CST |
| Content-Type: |
text/plain |
| Old-Return-Path: |
|
| Date: |
Fri, 15 Mar 1996 09:01:33 -0800 |
| Precedence: |
list |
| Resent-From: |
|
| From [log in to unmask] Mon Mar 18 08: |
35:26 1996 |
| Resent-Sender: |
|
| Content-Transfer-Encoding: |
7bit |
| Status: |
O |
| X-Mailing-List: |
|
| TO: |
|
| Return-Path: |
|
| X-Status: |
|
| Resent-Message-ID: |
<"v06C43.0.UXD.r5QIn"@ipc> |
| Subject: |
|
| From: |
|
| X-Loop: |
|
| Mime-Version: |
1.0 |
| X-Mailer: |
SPRY Mail Version: 04.00.06.21 |
| Message-Id: |
|
| Parts/Attachments: |
|
|
WE currently use vias with pads of .024" to .028" and holes of .014" to .018".
The spec on the holes is +0"/-closure. There is no filleting allowed presently,
but we to permit 90 degrees of breakout(not at the conductor junction).
My questions are as follows:
1) What are the risks of the present specification?
2.) What are the risks and benefits of filleting the via pads? Can any
electrical problems arise from this? If so, what?
3.) If you recommend filleting the via pads, do you do it in house or do you
have your supplier add the fillets? What do you recommend for existing
designs where there is a cost to revise the artwork?
Tim Fowler
BENTLY NEVADA CORPORATION
|
|
|
