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| From [log in to unmask] Thu Feb 29 09: |
53:07 1996 |
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The issue is whether components will be mounted into the holes.
IPC-6012, Qualification and Peformance Specification for Printed Rigid
Boards (to supersede IPC-RB-276), states that solder mask may tent or
plug vias or through holes, as long as the hole is not required to be
solder filled.
If a component is to be mounted through the hole, the mask cannot
"encroach" upon the barrel of the hole.
Mike Buetow
IPC Technical Staff
2215 Sanders Road
Northbrook, IL 60062
P: 847-509-9700, ext. 335
F: 847-509-9798
[log in to unmask]
On Wed, 28 Feb 1996 [log in to unmask] wrote:
> soldering that side (the actual electronics are on top). Simple solder mask
> seems to prevent these bumps from being formed. Is there an IPC
> recommenddaation about soldermasking over thru-hole vias? The hole may or
> may not be closed by the mask.
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