Mime-Version: |
1.0 |
Content-Type: |
text/plain; charset="us-ascii" |
Old-Return-Path: |
|
Date: |
Tue, 27 Feb 1996 10:18:39 -0500 |
Precedence: |
list |
Resent-From: |
|
Resent-Sender: |
|
X-Status: |
|
Status: |
O |
X-Mailing-List: |
|
X-Sender: |
|
TO: |
|
Return-Path: |
|
X-Loop: |
|
Resent-Message-ID: |
<"k4OgB.0.SHG.3-nCn"@ipc> |
Subject: |
|
From: |
|
Received: |
by ipc.org (Smail3.1.28.1 #2)
id m0trR5Q-0000C4C; Tue, 27 Feb 96 09:13 CST |
From [log in to unmask] Tue Feb 27 09: |
16:58 1996 |
X-Mailer: |
Windows Eudora Pro Version 2.1.2 |
Message-Id: |
|
Parts/Attachments: |
|
|
We use a water soluble flux solder paste and get a 24 hour life on the
stencil with good results from 500 gram containers. This is a little beyond
recommended time. Stencils are stainless steel. Paste brand is SCM.
Dick Pond
At 01:27 PM 2/27/96 -0100, you wrote:
>(Thanks to technet for the reactions on my questions on aqueous/IPA cleaning
>and assembly carriers)
>
>Question :
>
>Is the "stencil-life" of solder pastes with water soluble flux really that
>bad? Can someone give me some practical data (hrs, batch-size, stencil-type,
>paste-manufacturer etc)? (...data, data, need more input...)
>
>Thanks again!
>
>*******************************
> Ivo de Rooij
> Process Engineer
> Surface Mount Assembly
> Fokker Elmo BV
> P.O. Box 75
> 4630 AB Hoogerheide
> The Netherlands
> phone (+31)(0) 164 - 6 17 000
> fax (+31)(0) 164 - 6 17 700
> e-mail [log in to unmask]
>*******************************
>
>
>
>
|
|
|