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by ipc.org (Smail3.1.28.1 #2)
id m0tr4V3-00008aC; Mon, 26 Feb 96 09:06 CST |
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Mon, 26 Feb 96 13:59:01 -0500 |
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Mon, 26 Feb 96 14:04:01 -0500 |
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<"XbPYd.0.SP6.SnSCn"@ipc> |
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| From: |
"Jim Marsico" <"marsico%Organization=Industrial & Mfg'g Engineering%Telephone=516-595-5879"@a1.allin1.ALLIN1.umc> |
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ALL-IN-1 IOS Server for VMS V3.0 PBL123A (US) ENGLISH 21-MAR-1992 |
| From [log in to unmask] Mon Feb 26 14: |
21:09 1996 |
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<31600162206991/151845@ALLIN1> |
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Reflowing solder paste on fiducials and in-circuit test pads shouldn't cause
any problems. We've been performing ICT on assemblies with solder on the test
pads for years. I can't speak for all, but I know that the majority of
component placement systems can read solder coated fiducials quite well.
Jim Marsico
[log in to unmask]
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