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The following documents are now published and available from IPC:
J-STD-020: Moisture/Reflow Sensitivity Classification for plastic
Integrated Circuit Surface Mount Devices. $20 member/$40 non
"The purpose of this test method is to identify the classification level
of plastic IC Surface Mount Devices (SMDs) that are sensitive to
moisture-induced stress so that they can be properly packaged, stored,
and handled to avoid subsequent mechanical damage during assembly solder
reflow attachment and/or repair." Supersedes IPC-SM-786 and JEDEC
JESD22-A112.
IPC-3408: General Requirements for Anisotropically Conductive Adhesive Films.
$10 members/$20 non
"This document covers requirements and test methods for anisotropically
conductive adhesive films used to bond and electrically connect components
and for their long-term properties as a part of the printed wiring board
assembly. Applications include the following: flexible PWB-to-glass,
flexible PWB-to-rigid PWB, flip chip-to-glass, flip chip-to-flexible PWB,
flip chip-to-rigid PWB, and fine pitch SMD. The adhesive film may be
supplied pre-attached to a flexible circuit or other product." "This
standard defines anistropically conductive adhesive films (also known as
Z-axis films, ZAF) through specification of test methods and inspection
criteria."
if you have any questions, please send an email or call Doug Sandvick at
IPC, 847/509-9700, ext. 393.
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