Received: |
by ipc.org (Smail3.1.28.1 #2)
id m0taN3D-0000NxC; Thu, 11 Jan 96 07:28 CST |
Lines: |
24 |
Old-Return-Path: |
|
Date: |
Thu, 11 Jan 1996 13:16:29 GMT |
Precedence: |
list |
Resent-From: |
|
Resent-Sender: |
|
X-Status: |
|
Status: |
RO |
X-Mailing-List: |
|
TO: |
|
Return-Path: |
|
From [log in to unmask] Thu Jan 11 10: |
41:57 1996 |
Resent-Message-ID: |
<"jHhaq.0.YtD.n1Hzm"@ipc> |
Subject: |
|
From: |
|
X-Loop: |
|
Reply-To: |
|
X-Mailer: |
PCElm 1.10 |
Message-Id: |
|
Parts/Attachments: |
|
|
In message <[log in to unmask]> [log in to unmask] (Mike Cussen) writes:
> Question:
>
> Is there information available about types of bonding or adhesives compounds used to
> stabilize components on PWB's. Example: hot melts, silicone and epozy.
>
> The marketing cataloges offer many, many different types of adhesives, with
> discreptions that there products will work for stabilizing PWB components. This is
> good but what I need is staticstical data that supports those adhesive.
>
I am presenting a paper at Nepcon West next month entitled "Case Histories of
Radiation Curing for Electronic Packaging". It contains details of using
photocure (UV and/or visible light) adhesives for just this application. These
adhesives are usually acrylic based, cure in seconds, and can meet some pretty
tall specs, including automotive, Bellcore, etc.
E-mail me if you want US supplier details.
Peter Swanson
INTERTRONICS
Oxfordshire, England
Tel: +44 1865 842842
[log in to unmask]
|
|
|