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by ipc.org (Smail3.1.28.1 #2)
id m0vcbpq-0000TSC; Tue, 24 Dec 96 12:44 CST |
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Tue, 24 Dec 1996 13:53:27 -0500 |
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| From [log in to unmask] Mon Dec 30 08: |
34:43 1996 |
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Trace width is typically not a reliability issue, particularly after
assembly. If your assemblies have survived yhe assembliy processes (solder
reflow temperature excursions) without post separations, your thin trace
width do not have a reliability down-side, if as you indicate the lines are
adequate for both current carrying capacity. Why do you ask about a
temperature range of -55C to 125C? That temperature range exists only in test
chambers and should NEVER be used for full assemblies because you seriously
damage, possibly destroy, your good solder attachments.
Werner Engelmaier
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