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From [log in to unmask] Mon Dec 23 12: |
07:00 1996 |
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<"GQzqQ1.0.xcI.xSOko"@ipc> |
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Dear Technetters:
We manufacture boards used in particularly harsh environments and we're
working to convert the fabricated boards to SMOBC from solder mask over fused
tin/lead.
What data or documents are avalable to support the reliability of a
conversion from solder mask over fused tin/lead to SMOBC? (MIL-Specs, OEMs
that have already converted, etc).
Thanks in anticipation of response,
Jim Noble
Printed Circuit Corporation
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