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by ipc.org (Smail3.1.28.1 #2)
id m0vamVX-0000UFC; Thu, 19 Dec 96 11:43 CST |
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Thu, 19 Dec 1996 11:01:39 -0600 |
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| From [log in to unmask] Mon Dec 23 12: |
06:56 1996 |
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<"Z1eNC2.0.1RF.ExNko"@ipc> |
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TechNet,
Searching for comprehensive packaging guidelines, procedures,
standards, handbook, etc. for shipping/handling/transportation of
electronic components (DIP's, SMD's, etc.).
Are their generally accepted practices (ASTM, IPC, MIL, etc)for
packaging and materials methods used in providing optimum protection
to the product (physical support and transportation hazards such as
ESD) ?
D.Drake
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