TECHNET Archives

1996

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Received:
by ipc.org (Smail3.1.28.1 #2) id m0tq0QF-00008aC; Fri, 23 Feb 96 10:32 CST
Sender:
[log in to unmask] () (from www-33-194.gnn.com. 205.188.33.194)
Old-Return-Path:
Date:
Fri, 23 Feb 1996 09:35:49
Precedence:
list
Resent-From:
Resent-Sender:
X-Status:
Status:
O
X-Mailing-List:
<[log in to unmask]> archive/latest/2855
From [log in to unmask] Mon Feb 26 13:
20:06 1996
TO:
Return-Path:
X-Loop:
Resent-Message-ID:
<"0niCl.0.kT8.gmUBn"@ipc>
Subject:
From:
Dave Rosato <[log in to unmask]> ()
Mime-Version:
1.0
Content-Type:
text/plain; charset="us-ascii"
X-Mailer:
GNNmessenger 1.2
Message-Id:
Parts/Attachments:
text/plain (18 lines)
I would appreciate anyone's help regarding problems with poor 
adhesion of Dupont 9400 series resist.  This film is prone to 
break down in our copper and tin tanks, and also in Body Plate 
Gold (most prevalent.)  We have tried a variety of process changes 
including increasing the laminating roll temp. to 120 degrees C.
but have not solved this problem.



Thanks all!

Dave Rosato
SAE Circuits Colorado, Inc.
(303) 530-1900
e-mail at [log in to unmask]



ATOM RSS1 RSS2