 
| Mime-Version: |
1.0 |
| Content-Type: |
text/plain; charset="us-ascii" |
| Old-Return-Path: |
|
| Date: |
Wed, 18 Dec 1996 09:41:15 +0100 |
| Precedence: |
list |
| Resent-From: |
|
| Resent-Sender: |
|
| X-Status: |
|
| Status: |
O |
| X-Mailing-List: |
|
| X-Sender: |
|
| TO: |
|
| Return-Path: |
<TechNet-request> |
| Resent-Message-ID: |
<"G5kZU.0.GlR.xhwjo"@ipc> |
| Subject: |
|
| From: |
|
| X-Loop: |
|
| From [log in to unmask] Wed Dec 18 08: |
24:25 1996 |
| Received: |
by ipc.org (Smail3.1.28.1 #2)
id m0vaHLo-0000GTC; Wed, 18 Dec 96 02:27 CST |
| Message-Id: |
<v01520d00aedd5c783e17@[129.132.54.198]> |
| Parts/Attachments: |
|
|
Werner
I am reading a lot about these gold and silver plated pads and I made a lot
of reliability testing on the solder joints produced with these surfaces.
As a matter of fact, during the solder process we have to wait long enough
until all of the gold / silver is diluted in the solder joint without
forming intermetallics. Something I wonder is the fact, that a extended
soldering time does result in the growth of tin / copper or tin / nickel
intermetallics. do you have any information about this aspect ? And, is
there a way to have a glance on the results the IEEE Compliant Lead Task
Group achieved?
Merry Christmas
Cordially
Guenter
***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to: *
* [log in to unmask] with <subject: unsubscribe> and no text. *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] *
***************************************************************************
|
|
|
