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id m0vYeGd-0000UlC; Fri, 13 Dec 96 14:31 CST |
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| From [log in to unmask] Fri Dec 13 14: |
33:51 1996 |
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A very good point brought up by Mr. Engelmaire!
I am also wondering if any reliability tests done on the solder joint to show
the effect, if any, of Ag/Sn intermetallics?
Jauwhei Hong
Racal-Datacom
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