 
| Received: |
by ipc.org (Smail3.1.28.1 #2)
id m0vYHM9-0000S6C; Thu, 12 Dec 96 14:03 CST |
| X-Incognito-Sn: |
1069 |
| Old-Return-Path: |
|
| Date: |
Thu, 12 Dec 96 11:50:54 PST |
| Precedence: |
list |
| Resent-From: |
|
| Resent-Sender: |
|
| X-Status: |
|
| Status: |
O |
| X-Mailing-List: |
|
| TO: |
|
| Return-Path: |
<TechNet-request> |
| X-Loop: |
|
| From [log in to unmask] Thu Dec 12 16: |
06:18 1996 |
| Subject: |
|
| X-Priority: |
3 (Normal) |
| From: |
|
| Resent-Message-ID: |
<"L4Zj62.0.gJO.WK6io"@ipc> |
| X-Incognito-Format: |
VERSION=2.01a ENCRYPTED=NO |
| Message-Id: |
|
| Parts/Attachments: |
|
|
Can you be more specific, I think everyone experiences an increased
defect rate at finer lines and spaces. Can you tell us what type of
resist you are using? What is the surface prep prior to DF lamination?
Are you seeing alot of resist chips in your developer or etcher?
Are you catching the defect at AOI or Test? Are you pattern plating or
panel plating? What type of stripper are you using? Please answer
these questions first, then maybe this forum can you give some help.
Regards,
Josh Moody
Merix Corp.
***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to: *
* [log in to unmask] with <subject: unsubscribe> and no text. *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] *
***************************************************************************
|
|
|
