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Victor,
Yes, this can be accomplished. The critical parameters are in your
reflow oven profile. Obviously the design (component layout) must be in
place also. Unfortunately, I can not share much more information because
of company confidentiality.
Jim Wilson
Jabil Circuits Inc.
[log in to unmask]
______________________________ Reply Separator _________________________________
Subject: Re[2]: BGA assembly.
Author: ddhillma <[log in to unmask]> at Jabil_Internet
Date: 12/10/96 10:42 AM
Hi Victor -
BGAs on both sides is doable - but it is not very much fun. I have
seen some SMT test boards with double sided BGA but there was careful
selection of BGA pad size and weight so that the solder surface
tension was favorable and the reflow profile was very rigidly
controlled with little room for error/changes. The process window was
considered to be too tight and the design never went to production.
There may be other TechNetee's that have made the last leap. Good
luck.
Dave Hillman
Rockwell Collins
[log in to unmask]
______________________________ Reply Separator _________________________________
Subject: Re: BGA assembly.
Author: [log in to unmask] at ccmgw1
Date: 12/10/96 10:08 AM
Hi Victor,
I have seen one side QFP and the other side BGA. Both sides mount with BGAs,
I have not seen before.
To do that, reflow the side with QFP first, of course please remember to
glue the
QFP, then reflow the other side with BGA.
That's all...This is what I have seen.
In case you ever seen reflow BGA both sides of the Board, please do tell
me. I am
curious to know too..
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