TECHNET Archives

1996

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Mime-Version:
1.0
Content-Type:
text/plain; charset="us-ascii"
Old-Return-Path:
Date:
Mon, 9 Dec 1996 14:19:00 +0200 (IST)
Precedence:
list
Resent-From:
Resent-Sender:
TechNet-request [log in to unmask]
X-Status:
Status:
O
From [log in to unmask] Mon Dec 9 11:
46:57 1996
X-Sender:
TO:
Return-Path:
<TechNet-request>
X-Loop:
Resent-Message-ID:
<"utVL-2.0.rAN.pM0ho"@ipc>
Subject:
From:
"Eltek Ltd. - Process Engineering" <[log in to unmask]>
X-Mailing-List:
<[log in to unmask]> archive/latest/8331
Received:
by ipc.org (Smail3.1.28.1 #2) id m0vX4o0-0000SKC; Mon, 9 Dec 96 06:27 CST
X-Mailer:
Windows Eudora Light Version 1.5.2
Message-Id:
Parts/Attachments:
text/plain (23 lines)
We are looking for dry film solder mask nominal thickness 1 mill ( 25
microns ) . 
Information such as : manufacturers , practical experience with vaccum
laminators ,
processing etc will be very appreciated
Szpruch Edward
Eltek
Tel 97239395050
Fax 97239309581
E-mail [log in to unmask]

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to:           *
* [log in to unmask] with <subject: unsubscribe> and no text.        *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact   *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask]      *
***************************************************************************



ATOM RSS1 RSS2