TECHNET Archives

1996

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Mime-Version:
1.0
Content-Type:
text/plain; charset="us-ascii"
Old-Return-Path:
Date:
Wed, 21 Feb 1996 09:54:03 -0600
Precedence:
list
Resent-From:
Resent-Sender:
X-Status:
Status:
O
From [log in to unmask] Mon Feb 26 12:
25:32 1996
X-Sender:
TO:
Return-Path:
X-Loop:
Resent-Message-ID:
<"nVFto.0.UDD.bypAn"@ipc>
Subject:
From:
Steve Quinn <[log in to unmask]>
Received:
by ipc.org (Smail3.1.28.1 #2) id m0tpGnm-0000WFC; Wed, 21 Feb 96 09:49 CST
X-Mailing-List:
<[log in to unmask]> archive/latest/2807
X-Mailer:
Windows Eudora Pro Version 2.1.2
Message-Id:
Parts/Attachments:
text/plain (13 lines)
        We are wondering what is the latest rev of this spec(IPC-A-600D).
We have one dated 9-25-89.  Specifically we are questioning allowable
plating voids in through holes.  Are circumferential voids acceptable in
current spec?  

        Thanks for the help.

                Steve Quinn
                Heurikon Corp




ATOM RSS1 RSS2