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From [log in to unmask] Fri Dec 6 15: |
26:01 1996 |
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Hi Again Alex -
One more thing - the MELF use I described is for surface mount only -
our wave solder investigations found that MELFs were damaged
(destroyed) due to thermal shock during bottom side wave soldering.
Dave Hillman
Rockwell Collins
[log in to unmask]
______________________________ Reply Separator _________________________________
Subject: ASSY: MELF's
Author: [log in to unmask] at ccmgw1
Date: 12/5/96 4:01 PM
Techies:
Our engineering department wishes to use a MELF package (National
Semiconductor LL-34) for a diode on a new design. They intend to mount
this part on the bottom side of the PCB. Last I heard, this type of
package caused major headaches and extra cost during assembly. Has
anyone out there used this package in high-volume production? What are
the known pitfalls today? What percentage increase in assembly cost can
we expect (if any)? What footprint works the best (SM-782 has 2
recommendations, one has notched pads to help keep the part from
rolling)? Any other gotchas we should be aware of?
Thank you in advance for your help - Alexis Meehan - ATI
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