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| From [log in to unmask] Fri Dec 6 12: |
08:17 1996 |
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Techies:
Our engineering department wishes to use a MELF package (National
Semiconductor LL-34) for a diode on a new design. They intend to mount
this part on the bottom side of the PCB. Last I heard, this type of
package caused major headaches and extra cost during assembly. Has
anyone out there used this package in high-volume production? What are
the known pitfalls today? What percentage increase in assembly cost
can we expect (if any)? What footprint works the best (SM-782 has 2
recommendations, one has notched pads to help keep the part from
rolling)? Any other gotchas we should be aware of?
Thank you in advance for your help - Alexis Meehan - ATI
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