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[log in to unmask] wrote:
> Our in house SMT assembly facility has asked that we tent our vias on top and
> bottom sides to aid in solder bridge reduction. If bottom tenting is not
> possible becaues vias may double as test points, they ask that we still tent
> the top (component) side. They use a no clean process.
I am not the one to answer your question about contaminants, but I am curious
about something. We have tented vias, but not to prevent bridging. Is solder
bridging across vias a common problem?
Can I ask what pad size you are using, and how close together they are placed?
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