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Frank,
Your alternative are :
1- COB ( chip on board with wire bond )
2- If you really want to stay flip chip for speed. Go for BGA
on ceramic. This could be very interesting if you have an high I/O
count like 300 solder bump.
3 - Flip chip are costly ( more than a standard COB ) however
some way cost probably less like plating the bump.
Good luck !
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