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Does anyone have a copy of the NATIONAL ELECTRONIC PACKAGING AND
PRODUCTION CONFERENCE PROCEEDINGS OF THE TECHNICAL PROGRAM(WEST
AND EAST) 1996 '(NEPCON WESTWEST'96) I need the following
articles. Worldwide trends in flip chip developments:by
Vardman_EJ & Goodman_TW (VOL.2 pp 973-975) and
Laminate technology update for multichip modules. by:Trent_J
pp922-929
Frank Frimpong
[log in to unmask]
OR
[log in to unmask]
FAX 44 (0) 01782787259
Tanx in advance
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