 
| Received: |
by ipc.org (Smail3.1.28.1 #2)
id m0vT217-0000QBC; Thu, 28 Nov 96 02:40 CST |
| Content-Type: |
text/plain; charset=us-ascii |
| Old-Return-Path: |
|
| Date: |
Thu, 28 Nov 1996 08:36:53 +0000 |
| Precedence: |
list |
| Resent-From: |
|
| From [log in to unmask] Tue Dec 3 14: |
03:34 1996 |
| Resent-Sender: |
|
| Content-Transfer-Encoding: |
7bit |
| Status: |
O |
| X-Mailing-List: |
|
| TO: |
|
| Return-Path: |
<TechNet-request> |
| X-Status: |
|
| X-Loop: |
|
| Resent-Message-ID: |
<"dOSj31.0.9YE.q_Kdo"@ipc> |
| Subject: |
|
| From: |
|
| MIME-Version: |
1.0 |
| Message-ID: |
|
| Organization: |
Cork RTC |
| X-Mailer: |
Mozilla 3.0 (WinNT; I) |
| Parts/Attachments: |
|
|
I am currently trying to model E-glass epoxy printed circuit boards
during reflow soldering on Ansys ( Finite element package). During
soldering the temperature exceeds glass transition temperature.
I am trying to obtain force v Deflection or Stresss strain curves at
various temperatures eg 20,140, 220 for various types of epoxy resins to
model the effects of plasticity on board warpage.
If anyone has results available for any brand of resin i would be
grateful if you could contact me.
Thanks
paul barry
***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to: *
* [log in to unmask] with <subject: unsubscribe> and no text. *
***************************************************************************
|
|
|
