 
| Received: |
by ipc.org (Smail3.1.28.1 #2)
id m0toupw-00005JC; Tue, 20 Feb 96 10:22 CST |
| Old-Return-Path: |
|
| Date: |
Tue, 20 Feb 96 11:25:04 EST |
| Precedence: |
list |
| X-Loop: |
|
| Resent-Sender: |
|
| X-Status: |
|
| Status: |
O |
| X-Mailing-List: |
|
| TO: |
|
| Return-Path: |
|
| Resent-Message-ID: |
<"VgrNa2.0.su5.JLVAn"@ipc> |
| From [log in to unmask] Tue Feb 20 16: |
57:16 1996 |
| From: |
|
| Subject: |
|
| Resent-From: |
|
| Message-Id: |
|
| Parts/Attachments: |
|
|
We are starting designs using BGA's. It's our first application of
this technology and would like to understand what the industry is
recommending for the PCB pattern design on the PCB. Any articles or
papers that you can recommend will be appreciated.
THANKS PH 407 830 5522 EX 231
Tim Moulton FAX 407 260 5366
CAD Manager
|
|
|
