Mime-Version: |
1.0 |
Content-Type: |
text/plain; charset="us-ascii" |
Old-Return-Path: |
|
Date: |
Tue, 26 Nov 1996 08:10:47 +0200 (IST) |
Precedence: |
list |
Resent-From: |
|
From [log in to unmask] Tue Dec 3 11: |
36:17 1996 |
Resent-Sender: |
|
X-Status: |
|
Status: |
O |
X-Mailing-List: |
|
X-Sender: |
|
TO: |
|
Return-Path: |
<TechNet-request> |
Resent-Message-ID: |
<"4kFG61.0.9q2.sUeco"@ipc> |
Subject: |
|
From: |
|
X-Loop: |
|
Received: |
by ipc.org (Smail3.1.28.1 #2)
id m0vSGaF-0000R6C; Tue, 26 Nov 96 00:01 CST |
X-Mailer: |
Windows Eudora Light Version 1.5.2 |
Message-Id: |
|
Parts/Attachments: |
|
|
Hello Technet !
We intend to switch our PTH process from thin copper electroless plus
electrolytic strike to thick ( hot ) electroless , 2 microns thick . The
line will be loaded with baskets , so we do expect the PCBs will be
oxidized.We are considering some kind of chemical treatment prior to dry
film lamination instead of pumice scrub.Wjhat kind of treatment is recommended ?
***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To unsubscribe from this list at any time, send a message to: *
* [log in to unmask] with <subject: unsubscribe> and no text. *
***************************************************************************
|
|
|